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TAG: pid

picoReflow

More and more semiconductors are produced in packages (the chip's case) which have become impossible to hand solder with a solder iron. The switch from through-hole (THT) to surface mount technology (SMT) has actually made hand soldering much easier (although still many believe the opposite to be true) but now we are faced with BGA and other packaging forms which only have contacts on the bottom of the chip.